XPost: sci.electronics.components, sci.electronics.design, sci.e   
   ectronics.repair   
   From: krw@nowhere.com   
      
   On Fri, 01 Apr 2016 17:21:31 -0400, "Michael A. Terrell"   
    wrote:   
      
   >   
   >krw wrote:   
   >>   
   >> Michael A. Terrell wrote:   
   >> >   
   >> >   How were the new caps stored? If it is where they can adsorb   
   >> >moisture, you can damage them with an iron that is too hot.   
   >>   
   >> I haven't had any problems with cracking but I used to have problems   
   >> with end caps falling off.  I haven't seen the issue for some time,   
   >> though perhaps it was a problem with the manufacturer.  Our purchasing   
   >> group prefers Murata, so that's what I use (GRM series).   
   >   
   >   
   >   We pre baked some boards and other components before assembly and   
   >reflow. That eliminated cracked multilayer SMD capacitors, tombstoning   
   >of two lead components and losing end caps. That was in N Central   
   >Florida which has plenty of humidity problems.  The so called HVAC   
   >'engineers' were clueless about how to control the humidity, so we had   
   >to resort to baking. LSI SMD ICs were backed and heat sealed into   
   >antistatic bags with moisture adsorbing packets.   
      
   Sure, baking humidity sensitive parts is common before pick-n-place.   
   It's a bit less common when hand (de)soldering, though.  ;-)   
      
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