(Phys.org) — A technique developed several years ago at the National Institute   
   of Standards and Technology (NIST) for improving optical microscopes now has   
   been applied to monitoring the next generation of computer chip circuit   
   components, potentially    
   providing the semiconductor industry with a crucial tool for improving chips   
   for the next decade or more.   
      
   The technique, called Through-Focus Scanning Optical Microscopy (TSOM), has   
   now been shown able to detect tiny differences in the three-dimensional shapes   
   of circuit components, which until very recently have been essentially   
   two-dimensional objects.    
   TSOM is sensitive to features that are as small as 10 nanometers (nm) across,   
   perhaps smaller—addressing some important industry measurement challenges for   
   the near future for manufacturing process control and helping maintain the   
   viability of optical    
   microscopy in electronics manufacturing.   
      
    Read more at: http://phys.org/news/2013-06-microscopy-technique   
   industry-d-components.html   
      
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