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|    sci.electronics.basics    |    Elementary questions about electronics    |    72,318 messages    |
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|    Message 70,599 of 72,318    |
|    Dimitrij Klingbeil to Ray Otwell    |
|    Re: What size of surface-mount component    |
|    22 May 18 01:00:09    |
      From: nospam@no-address.com              On 20.05.2018 05:06, Ray Otwell wrote:       > From time to time I have wondered if a very narrow tip could be used       > for the larger SMT items. I've seen tutorials on how to do the SOP       > and SSOP packages with larger tips.. It doesn't look easy at all,       > but doable. ...              In principle, both ways are possible. You might be surprised how small       those narrow tips can be made.              Weller makes one called the "LT 1S" - it's 0.2 mm (<8 mil) round tip.              I've used it a while ago, it works reasonably well (*). With some care       and dexterity it can even fit between the pins of a 0.5 mm pitch TQFP       to remove an accidental solder bridge. It should however be considered       a precision tool and treated accordingly - avoid application of force,       overly high temperature (below 370 °C is reasonable) and make sure that       it's maintained wetted at all times to prevent surface oxidation.              This type of fine tip does not tolerate abuse at all well.              There are special-purpose tips with even smaller dimensions. A Weller       "LT 1SCNW" has a 0.1 x 0.3 mm rectangular tip geometry, but it's not       designed for general-purpose soldering use. It's non-wettable, so you       can't actually apply solder to it. It can only heat up an already tinned       area and melt the solder that's already present there. It may (or may       not) be useful to clean up a mistake with a 0.4 mm pitch TQFP, I don't       really know. So far I've been lucky and never needed one.              It is quite possible to solder a part in a 0.5 mm TQFP100 package with a       "LT 1S" tip, working carefully pin by pin. If you made a layout mistake       and created a very tiny pad geometry where the pads do not extend enough       outward past the pins, and the traditional large flat tip sweeping all       pins approach will no longer work, this may be the only remaining way.       Be warned however that it's really labor-intensive, prone to mistakes,       and requires great care.              If the pad geometry allows it, working with a larger gull-wing type tip       and "drag soldering" a row of pins at once is certainly the far more       productive and less frustrating approach, and it places less demand on       manual dexterity too.              Regards       Dimitrij                     (*): Considering its size and the circumstances where it's likely to be       needed, that is.              --- SoupGate-Win32 v1.05        * Origin: you cannot sedate... all the things you hate (1:229/2)    |
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