From: jrwalliker@gmail.com   
      
   On 17/01/2026 04:58, Bill Sloman wrote:   
   > On 17/01/2026 4:19 am, john larkin wrote:   
   >> On Sat, 17 Jan 2026 03:59:00 +1100, Bill Sloman    
   >> wrote:   
   >>   
   >>> On 16/01/2026 11:01 am, john larkin wrote:   
   >>>> On Thu, 15 Jan 2026 23:01:38 +0000, John R Walliker   
   >>>> wrote:   
   >>>>   
   >>>>> On 15/01/2026 18:15, john larkin wrote:   
   >>>>>> On Thu, 15 Jan 2026 17:51:59 +0000, liz@poppyrecords.invalid.invalid   
   >>>>>> (Liz Tuddenham) wrote:   
   >>>>>>   
   >>>>>>> john larkin wrote:   
   >>>>>>>   
   >>>>>>>> On Thu, 15 Jan 2026 15:18:31 +0000,   
   >>>>>>>> liz@poppyrecords.invalid.invalid   
   >>>>>>>> (Liz Tuddenham) wrote:   
   >>>>>>>>   
   >>>>>>>>> john larkin wrote:   
   >>>>>>>>>   
   >>>>>>>>>> I need something like 1.5K resistance across a 750 volt pulse.   
   >>> Pulse   
   >>>>>>>>>> widths will be below 1 us.   
   >>>>>>>>>>   
   >>>>>>>>>> Three 1206's in series, 499r each, would work. Peak power   
   >>> dissipation   
   >>>>>>>>>> per resistor will be 125 watts at 250 volts. I think that's OK   
   >>> but I   
   >>>>>>>>>> want to test it.   
   >>>>>>>>>>   
   >>>>>>>>>> Here's the tester. The DUT (device under torture) will go   
   >>> across the   
   >>>>>>>>>> gap on the left.   
   >>>>>>>>> f   
   >>>>>>>>>> I have both regular thickfilm resistors and some thinfilms to   
   >>> test. I   
   >>>>>>>>>> theorize that the thinfilms will hold up better.   
   >>>>>>>>>   
   >>>>>>>>> Would a non-inductively-wound wirewound resistor work well   
   >>> enough? You   
   >>>>>>>>> would have plenty of mass to average-out the pulse energy.   
   >>>>>>>>   
   >>>>>>>> WWs are great for pulse overload, not so great for PCB density. The   
   >>>>>>>> best would be to use three (or two, or one) surface-mount 1206   
   >>>>>>>> thickfilm that we have in stock.   
   >>>>>>>>   
   >>>>>>>> I could stand a micohenry or so parasitic inductance. The 1.5K   
   >>> will in   
   >>>>>>>> fact be in series with a small inductor.   
   >>>>>>>   
   >>>>>>> There's your answer; make the resistor and the inductor one and   
   >>> the same   
   >>>>>>> component. For a small investment in suitable machinery this   
   >>> gives you   
   >>>>>>> total security of supply, quality control and an edge over any   
   >>>>>>> competitor who can't make things but just buys them in (or tries   
   >>> to copy   
   >>>>>>> your design without realising what that component really does).   
   >>>>>>>   
   >>>>>>> Vertical integration was the cornerstone of nearly all the   
   >>>>>>> successful   
   >>>>>>> electronics firms. (Philips even owned the sand quarries to   
   >>> supply the   
   >>>>>>> sand to make the glass to make the valves and light bulbs.)   
   >>>>>>>   
   >>>>>>> Experiment with winding a number of turns of resistance wire on a   
   >>> former   
   >>>>>>> in one direction, then winding some more in the opposite   
   >>> direction. The   
   >>>>>>> ratio between the two sets of turns can be adjusted to give the   
   >>> required   
   >>>>>>> inductance and the total number of turns gives the resistance. The   
   >>>>>>> former could be a small piece of heatproof material shaped like a   
   >>> dog's   
   >>>>>>> bone to retain the wire, with a notch to catch the wire and   
   >>>>>>> prevent it   
   >>>>>> >from unwinding at the reversal point.   
   >>>>>>   
   >>>>>> Yikes. That would be a huge diversion from getting a product done.   
   >>>>>>   
   >>>>>> I found one paper that shows that thinfilms are tougher than   
   >>>>>> thickfilms, but thinfilm MELFs are even better. That makes sense.   
   >>>>>>   
   >>>>>   
   >>>>> When I visited the factory of a smart meter manufacturer I noticed   
   >>>>> that   
   >>>>> they used melf surface mount resistors for mains voltage sensing.   
   >>>>> There   
   >>>>> were several in series.   
   >>>>> John   
   >>>>   
   >>>>   
   >>>> Makes sense. For a given pcb footprint, they have about pi times the   
   >>>> surface area to work with, for a correspondingly bigger conductor   
   >>>> area. The cooling might be even better.   
   >>>   
   >>> This misses the point. The Vishay resistor data showed that - at least   
   >>> for their surface mount thin film resistors - the heat doesn't get   
   >>> beyond the resistive track itself for about 300usec.   
   >>>   
   >>> If you get the track too hot for any time shorter than that it can melt   
   >>> (or at least get hot enough to let the atoms move around). For their   
   >>> resistors, nothing lower than 10k can take 1kV, which equates to a peak   
   >>> current of 100mA.   
   >>>   
   >>> Once you've work out how much resistive area you need to use to work   
   >>> with any pulse shorter than 300usec, you then need to work out the duty   
   >>> cycle of your short pulses and make sure that you can dissipate the   
   >>> average power to ambient without getting the average temperature too   
   >>> high.   
   >>   
   >> I don't expect to have much average power dissipation. The resistor on   
   >> my prototype is rising about 15c at 180 watts and 1 us/1KHz pulses,   
   >> according to my thermal imager. Do the math on that.   
   >   
   > You'd need to identify the resistor so that I could get the thermal   
   > resistance of the resistor to ambient before I could do that. If you   
   > knew what you were talking about you'd know that   
   >   
   >>> MELF resistors may have more surface area to dissipate heat over the   
   >>> long term but the peak short term power dissipation limit is strictly   
   >>> determined by what is happening in the resistive track itself.   
   >>   
   >> But a MELF can have a longer and wider resistance track compared to a   
   >> planar equivalent.   
   >   
   > But most resistors dissipate most of the heat they generate into the   
   > printed circuit board on which they are mounted. Planar surface mount   
   > resistors do that a lot better than MELFs.   
      
   Do you have any data for that? In both cases the substrate is alumina   
   which has a high thermal conductivity. MELFs have crimped on end caps   
   which probably provide good thermal conduction into the pcb pads.   
      
    If you are less worried about   
   > the average power dissipation and just want high peak dissipation, MELFs   
   > may look attractive, but that long track is likely to be an inductive   
   > helix, which may be less attractive in your application.   
   >   
      
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