From: uucp@crashelex.com   
      
   On 1/29/2025 4:41 AM, HW wrote:   
   > On some boards, the SMD components are glued down prior to wave   
   > soldering.   
   >   
   > What is the best method for removing these parts, preferably without   
   > damage?   
      
   Most of the adhesives used for this soften at solder-melting   
   temperatures, so the parts can be fairly easily removed with hot air.   
      
   For large components, or less heat-sensitive underfill materials (I'm   
   looking at you, Apple...) some scavengers have had success using a mill   
   to grind away the PCB (for scavenging the part from a scrap board) or   
   the part itself (for removing a failed part to replace it).  Obviously,   
   it's important to get the PCB exactly level to the milling plane, and   
   precise depth control is critical.   
      
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   leave everyone alone.   
      
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