From: legg@nospam.magma.ca   
      
   On 29 Jan 2025 12:39:08 GMT, Roger Hayter  wrote:   
      
   >On 29 Jan 2025 at 12:29:57 GMT, "legg"  wrote:   
   >   
   >> On Wed, 29 Jan 2025 11:41:20 +0100, HW  wrote:   
   >>   
   >>> On some boards, the SMD components are glued down prior to wave   
   >>> soldering.   
   >>>   
   >>> What is the best method for removing these parts, preferably without   
   >>> damage?   
   >>   
   >> Unaware of one.   
   >>   
   >> Remove to replace only.   
   >>   
   >> RL   
   >   
   >Expensive or proprietory chips are regularly removed from donor boards with a   
   >mixture of hot air, flux and perhaps LMP solder, for reuse. But I agree no one   
   >is going to reuse a resistor or capacitor.   
      
   Epoxy dhesive is used on wave-solderable SMD assemblies, to   
   prevent parts being swept away in the wave process, or in   
   subsequent reapplication of reflow processes.   
      
   There is a body size, pinspacing limitation that prevents   
   most complex/costly parts from this manufacturing technique.   
   Consult your part vendor if in doubt.   
      
   The epoxy adhesive used, once cured, will not be degraded   
   at a later time by temperatures provided by hot air and bonds   
   stronger than most IC packaging material fracture stress limits.   
      
   RL   
      
   --- SoupGate-DOS v1.05   
    * Origin: you cannot sedate... all the things you hate (1:229/2)