It has come up that reducing the epoxy thickness in front of the photodiode   
   can be useful.   
   The process reminds me of the way they polish diamonds.    
   I am putting out this issue because I am interested in a semi-automated   
   machine to do this.    
   Here is what I have thought of:   
   A polished steel plate rotates.   
   A PD is pushed down onto the plate with a weighted vertical arm. The bpw34   
   (for example) is pushed against the flat, and "dopping wax" applied to glue it   
   to the vertical, which is a tube or rod. This wax is used by gem polishers as   
   a temporary holder for    
   the gem.   
   Then, a low cost capacitance meter is connected through the device or through   
   a small outrigger. This gauges the thickness, but a dial indicator could also   
   be used. Another measure is the current flow between table and PD. This is for   
   final approach.   
      
      
   Perhaps there is an easier way to do this - like using a solvent. I dunno.   
   jb   
      
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