From: d@d.d   
      
   Hello,   
      
      
   Intel Has Figured Out How To Compute In 3 Dimensions And It Could Put   
   The Company Back On Top   
      
      
   If you can’t increase performance by speeding up the chip, then the   
   obvious thing to do is to reduce the distance between chips. That’s the   
   idea behind the architecture called 3D stacking, which integrates   
   different chips together much like the integrated circuit combined   
   various components together on a single chip.   
      
   Stacking chips on top of each other would not only vastly reduce the   
   time circuits need to wait for instructions from each other and increase   
   speed significantly. It would also decrease power usage due to far   
   shorter communication paths. It seems like the perfect solution to a   
   thorny problem.   
      
   However, this approach comes with its own problems. Because the chips   
   are stacked on top of one another and heat travels upward, they tend to   
   overheat. So while the technique has been used for memory chips, no one   
   has been able to make it work for processing chips.   
      
   Until now, that is. That is essentially what Intel has achieved with its   
   Foveros technology. The company has announced that it cracked the   
   problem and that the technology will become available in the latter half   
   of 2019. It is a tremendous achievement and has the potential to put   
   Intel back on top.   
      
      
   Read more here:   
      
   https://www.innovationexcellence.com/blog/2019/06/10/intel-has-f   
   gured-out-how-to-compute-in-3-dimensions-and-it-could-put-the-co   
   pany-back-on-top/   
      
      
      
   Thank you,   
   Amine Moulay Ramdane.   
      
   --- SoupGate-Win32 v1.05   
    * Origin: you cannot sedate... all the things you hate (1:229/2)